JRF-BM800 Single-component silicone adhesive sealant, has excellent resistance to cold-thermal changes, anti-stress properties, high low temperature resistance, at -60 ~ 200 ℃keep long-term elasticity and stability, anti-UV, anti-aging, and has excellent insulation, moisture resistance, shock resistance ,corona resistance, anti-leakage and chemical resistance properties. in line with the EU ROHS directive.
Application :
- high frequency head, set-top boxes bonding fixed
- moisture-proof and waterproof encapsulation of sophisticated electronic components
- LED Display module and pixel waterproof encapsulation
- suitable for small or thin layer thickness (potting generally less than 6 mm) electronic components, modules, optoelectronic display and potting protection of circuit board.
How to use :
1.cleaning : clean up the surface of an object will be potting, remove rust, dirt and grease, etc.
2.sizing : unscrew the hose cap , squeeze glue on the clean surface, make it a natural leveling.
3.curing : sealing parts be placed in the air, after the epidermis formation, and then from the surface to the internal curing process, within 24 hours (at room temperature and 55% relative humidity), silicone sealant will solidify 2 ~ 4mm depth, the curing depth increases gradually with the extension of time , due to deep curing , need for a long time, so suggest single component silicone sealant generally used for small electronic components and a thin layer potting, 6 mm thick sealant fully cured need more than 7 days .
Note: It is recommended that the thickness is thicker than 6 mm potting choose double component types .
Before and after curing technology parameter table
Model No.
|
JRF-BM800
|
JRF-BM800
|
JRF-BM800
|
Before Curing
|
Appearance
|
Transparency
|
White
|
Black
|
Viscosity(cps)
|
5000~30000
|
5000~30000
|
5000~30000
|
Relative Density(g/cm3)
|
1.00~1.05
|
1.1~1.2
|
1.1~1.2
|
Surface Dry Time(min)
|
1.5-5
|
3-15
|
3-15
|
Completely Cure Time (d)
|
3~7
|
3~7
|
3~7
|
Curing Type
|
Neutral
|
Neutral
|
Neutral
|
After Curing
|
Hardness (Shore A)
|
25±5
|
25±5
|
25±5
|
Tensile Strength(MPa)
|
≥0.6
|
≥0.6
|
≥0.6
|
Shear Strength(MPa)
|
≥0.5
|
≥0.5
|
≥0.5
|
Elongation(%)
|
100~200
|
100~200
|
100~200
|
Use Temperature (℃)
|
-60~200
|
-60~200
|
-60~200
|
Volume Resistivity (Ω·cm)
|
≥5.0×1016
|
≥5.0×1016
|
≥5.0×1016
|
Dielectric Strength (kV/·mm)
|
≥20
|
≥20
|
≥20
|
Dielectric Constant (1.2MHz)
|
2.8
|
2.8
|
2.8
|
Loss factor (1.2MHz)
|
0.001
|
0.001
|
0.001
|
The above performance data were at 25 ℃, relative humidity of 55% measured 7 days after curing. Our company does not undertake relevant responsibilities for test conditions different or product improvement of data different .
Specification :
100 ml /pc , 100pc / carton