This series product is organic silicone as the main raw material, add heat resistance and excellent heat conduction performance materials as thermal conductive filler, made into thermal conductive filling gap glue .
The series is a pre cured colloid, don't need to prevent curing after assembly, save time, improve production efficiency .
Features:
1.Super soft: <10 degrees,
2.High thermal conductivity,
3.High and low temperature resistance
4. Without curing, convenient operation, high efficiency,
5.Excellent insulating performance, aging resistance, long storage life,
Application:
1.Converter and rectifier;
2.Energy conversion device;
3.Integrated circuit, CPU memory module;
4.Electronic and electrical heating spare parts.
5.LED lamp, power supply, UPS power supply etc.;
6.power semiconductor, fever transistor and MOSFET ;
7.Monitor, communication equipments and other consumer electronic products;
