Specifications
1.High thermal conductivity
2.Low thermal resistance
3.Stable performance
4.its viscosity high
5.Low hardness
Applications:
1. Car engine module and vehicle electronic equipment
2. Notebook computer, table computer CPU
3. Flat panel TV, mobile equipment, high-speed hard disk driver
4. Semiconductor and the radiating fin between
5. Computer, PC server, workstation
6. LED lighting device and mass storage device
Performance and characteristics:
1.High thermal conductivity, heat transfer coefficient 4.6W/m-k
2.Stable performance , low thermal resistance, effectively improve the heat transfer speed
3.Low hardness , its viscosity high, easy to use adhesive 4.By UL and V-O certification standards.
Specification:
Product standard size 330mm*330mm, 200mm*400mm according to customer needs cutting type Basic thickness 0.25mm*5.0mm, special size and thickness can be customized The product itself is slightly viscous, if need to strengthen the adhesive can be according to customer’ requirement. Product color is mass production, if need special color can be adjusted according to the actual situation
